Why MEMS gyroscopes need wafer-level vacuum packaging？

[kellyyu]

The microstructure of MEMS gyroscopes (microelectromechanical systems) needs to work in a vacuum environment to achieve a high resonance Q value and ensure its detection sensitivity. Vacuum packaging is also an important condition to ensure its detection accuracy. Wafer-level vacuum packaging is the mainstream process solution currently used for MEMS gyroscopes. Through wafer-level packaging, the microstructure of the MEMS gyroscope can be avoided from causing adhesion and particle pollution during the subsequent chip cutting process. It can also reduce the cost of vacuum packaging and improve the efficiency of MEMS gyroscopes. Chip processing yield. Wafer-level vacuum packaging can achieve device miniaturization and integration, and further improves the performance and reliability of MEMS gyroscopes to meet application needs in various fields.

Since the accuracy of the MEMS gyroscope is a decisive factor in its performance, and wafer-level vacuum packaging is an important condition for testing its accuracy, the wafer-level vacuum packaging of the MEMS gyroscope is important knowledge to understand. The ER-MG2-50/100 and produced by Ericco uses a hermetically sealed ceramic LCC surface mount package and is capable of operating with a 5V power supply and a wide temperature range (−40°C to +85°C).



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